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2026 International Symposium on Advanced Thermal Management Materials Speaker Deng Wen
Title: Development of Low-CTE Electronic Functional Ceramic Carriers for Packaging Applications
Biography
Dr. Deng Wen holds a PhD in Materials and Chemical Engineering from Tianjin University. He earned his master’s degree in Applied Chemistry from the Graduate School of Tianjin University in 1996. He has worked successively at Xiangtan Institute of Technology (now Hunan University of Science and Technology), DuPont (USA), LPKF (Germany), and BYD Company, serving as Lecturer, Project Manager, Department Manager, Factory Director, and Director.
In 2012, he founded a 3D Circuit Company, which was supported by the Innovation Fund for Small and Medium-sized Enterprises under the Ministry of Science and Technology and the Ministry of Finance. In August 2019, he founded Nanjing Maide Materials Co., Ltd., where he currently serves as Executive Director and General Manager.
Exclusive Interview with Thermal Management Expert
Focusing on the development of low-CTE electronic functional ceramic carriers for packaging, in your opinion, what are the most critical academic challenges in material design and property regulation in this field?
Deng:
Personally, I believe the core aspects of low-CTE electronic functional ceramic carriers are as follows:
As demands for CTE, Dk, Df, thermal conductivity and other properties of packaging carriers continue to rise, material formulation, ceramic microstructure design, and high-entropy ceramic systems deserve close attention.
Silica is an indispensable component in low-CTE formulations. Meanwhile, considering manufacturing costs and overall performance, early formulations also included other metal oxides, forming at least a ternary oxide system. From the perspective of ternary phase diagrams, various phases emerge at different temperature stages during the co-sintering process, leading to high complexity in material structure and composition. Besides material formulation, achieving precise temperature control curves (sintering profiles) during co-sintering to obtain high-performance low-CTE electronic ceramics is also one of the core challenges.
In the manufacturing of multilayer substrates, the inner-layer conductive silver paste is critical for microvia conduction and CTE matching.
Question 2
From the perspective of industry application and technology transformation, what are the key challenges and development opportunities faced by low CTE electronic functional ceramic carrier boards in the industrialization promotion process of advanced packaging?
Deng:
Upscaling of material dimensions to meet stacked packaging technologies such as CoWoS and CoWoP, while addressing the demand for large-size applications such as CPO.
Compared with the recently popular TGV and glass substrates, ceramic substrates possess superior multilayer manufacturing capability. In the multilayer development of TGV combined with ABF materials, microvia conduction and processing stress of glass substrates remain difficult issues.
The greatest opportunity comes from the growing demand scenarios including AI, high-frequency and high-speed communications, new energy vehicles, and high-power applications (high-speed rail, aerospace). Benefiting from the inherent thermal management advantages of ceramics, combined with the MCLP (Microchannel Cooling Plate) solution and material optimization, there will be considerable potential for development.
Question 3
Please introduce the technical layout, product planning and future development direction of Nanjing Maide Materials Co., Ltd. in the field of electronic functional ceramic carriers.
Deng:
Promote electronic functional ceramic substrates around the M3 strategy, with resource integration as the core model: Material, Manufacturing, Machine.
Focus on low-temperature processes similar to LTCC to achieve low energy consumption, high performance and low cost.
Pay attention to the demand for ceramic functional components (electrostatic chucks, probe cards) and structural parts for semiconductor manufacturing.
術語說明（保持專業(yè)一致性）
CTE：Coefficient of Thermal Expansion 熱膨脹系數
Dk / Df：介電常數 / 介電損耗
LTCC：Low-Temperature Co-fired Ceramics 低溫共燒陶瓷
TGV：Through-Glass Via 玻璃通孔
CoWoS / CoWoP / CPO：先進封裝架構（保留原文）
MCLP：Microchannel Cooling Plate 微流道冷板